Modeling Copper concentration in PCB

Electronics companies at the leading edge of performance are being forced to address board-level thermal requirements at the earliest stages of design. Printed circuit boards (PCBs) constitute the primary area where mechanical engineers can influence the thermal design at the conceptual design phase. So the ability to accurately predict the thermal performance of the PCB early in the development process is becoming more critical than ever before. A key limitation of tools designed to simulate the performance of PCBs early in the design process has been their inability to take into account the effects on thermal conductivity of localized concentrations of copper. FLOTHERM has got capabilities to explicitly model copper traces to get accurate results.