Thermal Analysis of CSP packages

Thermal Analysis of CSP packages

Intersil Corporation (ISIL) is a leader in the design and manufacture of high performance analog semiconductors. Hoping to turn thermal performance into a competitive advantage, rather than a potential late-cycle design flaw, Intersil chose to use the suite of analysis tools to characterize their most recent package designs. One such package was a custom CSP design for a Tier-1 customer. The customer required verification that this custom design would meet their thermal requirements in a number of different environments. Intersil was able to quickly and confidently predict the thermal performance of the custom CSP package using FLOTHERM. Now that the customer’s thermal questions have been assuaged, Intersil can move on to the next phase of contract negotiations.

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